Manufacturing line scale SGP.32 POPI Kigen

Your guide to manufacturing connected products at scale

April 11, 2025

As global demand rises for smarter, connected products, manufacturing leaders face a critical juncture: integrating connectivity without increasing complexity, cost, or compliance risk. For OEMs expanding into new markets, the shift to embedded connectivity, especially via eSIM, isn’t just a tech upgrade. It’s a business strategy when it comes to manufacturing connected products.

As the manufacturing world braces for the next wave of connectivity, a quiet yet powerful transformation is underway, driven not by flashy devices, but by the standards that govern how they connect. The ratification of new cellular eSIM standards—SGP.32 and its sibling SGP.41/42—marks a pivotal shift that could redefine how Original Equipment Manufacturers (OEMs) scale and manage connectivity across sectors.

These standards aren’t just incremental upgrades. They represent a fundamental evolution that promises to remove long-standing barriers to cellular IoT adoption, particularly for global and high-volume manufacturers. But are we ready to harness their potential?

A New Baseline: What SGP.32 Brings to the Table

SGP.32 rewrites the rulebook for cellular provisioning. Unlike previous models like SGP.02, which often required resource-heavy and power-draining provisioning processes, SGP.32 streamlines operations for IoT devices, especially those in constrained environments like smart meters, asset trackers, and embedded sensors.

Key benefits include:

Low-power profile downloads suitable for long-life, battery-operated devices
Improved flexibility and security with streamlined remote SIM provisioning (RSP)
Support for limited-capability devices, including those without SMS or full network interfaces
Broader compatibility with LPWAN cellular types, opening doors for new IoT verticals

Yet, it’s the ecosystem-wide interoperability promised by SGP.32 that truly makes it a game-changer. The framework enables Mobile Network Operators (MNOs), Mobile Virtual Network Operators (MVNOs), and OEMs to rely on certified, secure infrastructure removing bottlenecks that have traditionally made scaling slow and risky.

IFPP and the Power to Provision at Scale

Enter SGP.41/42 and IFPP (In-Factory Profile Provisioning)—the next logical extension of SGP.32. IFPP allows manufacturers to embed and provision connectivity profiles during production instead of relying on post-deployment, over-the-air provisioning. This advancement unlocks critical advantages for manufacturers:

Elimination of network dependency during the manufacturing phase.
Resilience to roaming restrictions, regional regulatory hurdles, and MNO lock-ins.
Flexible SKU management, reducing complexity and cost.
Localized testing and provisioning essential for regulated industries like automotive and healthcare.

The “batch mode” provisioning option is especially promising. It enables entire groups of devices to be configured and staged with their respective profiles simultaneously, accelerating time-to-market while maintaining flexibility across different regional deployments.

Why Manufacturers Should Pay Attention—Now

Suppose you manufacture connected products including IoT devices destined for multiple telecom circles, across continents or even within vast domestic networks. In that case, the new eSIM standards are not a mere technical footnote. They are the linchpin to global scalability.

Historically, a lack of standardization has tied OEMs to proprietary, inflexible SIM solutions. As a result, they’ve had to juggle multiple SKUs, navigate local carrier partnerships, and often rebuild device logic to support different connectivity needs. SGP.32 and SGP.41/42 break that pattern, introducing a generic, modular approach that scales with business needs.

Crucially, manufacturers must understand where in the production flow provisioning should occur, and how this shift affects automation, certification, and customer delivery. The earlier this understanding is developed—preferably through expert partners—the greater the competitive advantage when these standards become fully ratified.

ABI Research Report 2025

From Standards to Scale: An OEM’s Guide to IoT eSIM Success

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Strategic Guidance, Not Prescriptions

While the path to adoption may seem complex, this is not a call to rip and replace legacy systems overnight.
Instead, it’s an opportunity to:

Monitor standardization timelines and early compliance opportunities
Evaluate manufacturing readiness for IFPP integration
Cultivate partnerships with providers who offer pre-certified modules and interoperable management tools
Plan for future-proofing—mainly if your roadmap includes emerging markets or constrained environments

Early adopters will benefit from faster certification cycles, reduced time-to-market, and the ability to meet local compliance.

The Bottom Line

The ratification of SGP.32 and SGP.41/42 may not make headlines, but its ripple effects across connected manufacturing will be profound. Manufacturers with global ambitions—or simply those seeking scalable, agile production—must move beyond viewing eSIMs as a component and start seeing standards as a strategic lever.

When exporting to or operating across multiple regions—whether defined by geography or telecom boundaries—success hinges on embracing standardization. The right partner can help you decode and convert these new standards into a competitive differentiator.

Case study: Unlocking agility and global reach with In-Factory eSIM Provisioning at a leading wearable brand

iSIM-Greg-case-study-wearable-IFPP for connected products

Greg leads global product operations at a premium wearable tech company known for precision, performance, and design. For Greg, quality isn’t just tested at the end—it’s built in at every stage. That mindset extends beyond hardware to how the product connects the moment a customer powers it on.

As the team prepares for the international launch of their next-generation connected device, Greg faces a familiar challenge: how to deliver a consistent, flawless experience across dozens of countries—with guaranteed connectivity from the first power-on.

Maintaining separate SKUs for each region no longer serves the mission. Subassembly variations add complexity, fragment testing, and tie-up capital in stacked inventory. The further connectivity is pushed down the line, the more risk there is to that all-important first customer moment.

So Greg designs for certainty early.

By integrating In-Factory Profile Provisioning (IFPP) with Kigen’s eSIM solution, Greg’s team securely loads digital connectivity profiles during production – within minutes. Each wearable can now be pre-provisioned with a chosen terrestrial connectivity and satellite network profiles that span the globe right on the production line. No manual SIM handling. No regional SKU juggling. Just a single, globally compliant product built with connectivity assured from box to wrist.

One global SKU, pre-tested connectivity, and no surprises at launch.

This move doesn’t just reduce lead times or inventory, it reinforces the brand promise. Greg’s factory floor becomes a launchpad for flawless first impressions, with every device tested, certified, and ready for wherever it lands.

For Greg, quality is no longer something to check, it’s something to architect.

A Strategic Primer for Product, Production, and Quality Leaders

Written in knowledge partnership with Kigen, the ABI Research Whitepaper provides practical considerations behind adopting the latest eSIM standards (SGP.32 and SGP.41/42), even if you’re not steeped in telecom jargon. Whether you’re leading product innovation, overseeing factory automation, or ensuring quality and customer experience, the questions below are key to evaluating if now is the right time to act:

How can embedded connectivity improve the scalability and automation of our manufacturing process for smart products?
What are the risks and benefits of adding cellular connectivity to our existing product lines, especially when exporting to multiple countries?
How does pre-integrating connectivity during manufacturing reduce delays, quality issues, and post-deployment troubleshooting?
Can we reduce production costs and SKU complexity by building one globally connected version of our product?
What should we look for in partners or platforms to help us manage connectivity securely and efficiently without needing telecom expertise in-house?

The following report unpacks the answers to these questions—along with actionable insights—to help you evaluate your readiness and map a smarter, more connected path forward.

The turning point is here. The question is: will you lead it?