Kigen’s Insights from MWC and Embedded World 2025: The Evolution of Connectivity 

The early months of 2025 have been pivotal for the tech industry, with Mobile World Congress (MWC) in Barcelona and Embedded World in Nuremberg setting the stage for groundbreaking advancements. These events have long been at the intersection of mobile networks, IoT, and emerging technologies. This year, however, they underscored a deeper transformation: the convergence of AI, satellite connectivity, and seamless cellular integration. 

For Kigen, these events were a testament to the increasing diversity of device makers, the accelerating role of eSIM and iSIM technology, and the growing focus on automation for scalable cellular connectivity. With unprecedented industry momentum behind the SGP.32 standard and in-factory provisioning (IFPP), 2025 is shaping up to be the year when simplified, scalable, and intelligent connectivity truly takes off.
 

MWC 2025: A Record-Breaking Convergence 

MWC 2025 welcomed 109,000 attendees from 205 countries and territories, featuring over 2,900 exhibitors and more than 1,200 speakers, 41% of whom were women (GSMA). The event emphasized AI-driven network management, the evolution of 5G Standalone, and early discussions on 6G architectures. GSMA’s Mobile Economy Report projected that mobile technologies and services would generate nearly $11 trillion in economic value by 2030, with 5G connections surpassing two billion by the end of 2024 (GSMA). 

One of the strongest takeaways from MWC was the profound impact of AI and its integration across networks, devices, and services. AI-powered IoT (AIoT) and agentic AI were dominant themes, with all connectivity types—cellular, satellite, and hybrid solutions—playing a role in enabling intelligent, self-managing systems. 

From automated network slicing for 5G and 6G to real-time AI-driven IoT device optimization, AI is now embedded in nearly every connectivity aspect. Enterprises are looking to leverage AI not just for analytics but for autonomous decision-making at scale. This shift pushes the demand for seamless, intelligent connectivity solutions that enable real-time responsiveness. 

While MWC focused on broad industry trends, Embedded World honed in on the practicalities of IoT deployments. The sheer range of IoT devices on display illustrated  

that connectivity is no longer confined to traditional cellular use cases. From industrial automation to smart energy grids, embedded connectivity is becoming a prerequisite for real-time decision-making and AI-driven applications. 

SGP.32: Unlocking Global IoT Manufacturing with Simplified eSIM Provisioning

Here, eSIM and iSIM technologies were particularly prominent. The introduction of the GSMA SGP.32 standard for IoT eSIMs was widely discussed as a key enabler of global scalability. The new standard enhances interoperability, simplifies eSIM provisioning for OEMs, and aligns with the explosive growth in the eSIM market. Kigen’s recent webinar explored how this shift helps manufacturers create a single global SKU, reducing supply chain complexity and accelerating time-to-market. 

New technology evolutions can be daunting and confusing until they are commonplace, and many questions still surround the understanding of how best to move to or adopt SGP.32 solutions for the IoT eSIM future. Is it compatible with other standards, or interchangeable with prior ones? What does it provide to OEMs? Kigen experts were in high demand to address these and here are some examples, below.

The rise of iSIM-native solutions is one of the most exciting transformations in the connectivity landscape. At MWC, Ubiik announced the first iSIM-native NTN gateway, capable of utilizing satellite and terrestrial failover for uninterrupted IoT connectivity Read more. This showcases a broader industry shift towards integrating multiple connectivity protocols, ensuring resilience in the face of varying network conditions. 

This expanding IoT ecosystem is fueling demand for streamlined device connectivity management. The new SGP.32 standard is crucial in addressing these challenges by reducing the complexity of remote profile management and enabling greater automation. According to ABI Research, SGP.32 and In-Factory Profile Provisioning (IFPP) will play a key role in scaling cellular eSIM adoption by allowing devices to be provisioned in manufacturing, removing the need for post-production SIM swaps (ABI Research). 

This automation is a game-changer for OEMs, allowing them to ship devices with pre-configured connectivity, significantly simplifying global deployment. ABI Research highlights how IFPP is bridging the gap between traditional SIM management and a fully automated, scalable solution (ABI Research). 

Kigen’s Commitment: Simplifying Security & Offering Flexibility 

Amid these shifts, a pressing industry question is: How can we make integrating connectivity and security easier for manufacturers and service providers? 

Under the shared vision of Secure with Kigen with our ecosystem, we are addressing this challenge in three key ways: 

1. Seamless Security & Connectivity Integration – Whether starting with an evaluation kit (EVK) or collaborating with an established connectivity provider, Kigen’s solutions make it simple to integrate eSIM and iSIM into new designs. 

2. Speed to Market – We are demonstrating how quickly secure connectivity can be implemented. Our video with Kristian from Nordic Semiconductor and Lorens from Monogoto showcases just how rapid the process can be (see videos below). 

3. Global Scalability & Flexibility – Kigen ensures that manufacturers can future-proof their designs, supporting multi-network connectivity that adapts to different markets and regulatory environments. 

By simplifying security and connectivity at scale, we are ensuring that device makers can focus on innovation while leaving the complexities of connectivity to trusted partners. 

A Transformational Moment for the Industry 

MWC and Embedded World 2025 have proven that we are at a pivotal moment in the evolution of cellular connectivity. As automation, AI, and satellite technologies converge, eSIMs and iSIMs will serve as the foundation for connected products that seamlessly integrate intelligent network management and global scalability. 

This year, we observed:  

• A strong demand for solutions that make managing connectivity simpler at scale 
• A surge in new device makers entering the connectivity space  
• The rise of consultative services helping companies adopt AI-driven IoT solutions 
  

As we reflect on these shifts, one key takeaway is clear: 

“Every new evolution in connectivity unlocks doors for a new generation of innovators. The eSIM and iSIM revolutions are bringing in exciting new device makers who are experts in their field, while leaving connectivity to trusted partners. Many of these brands will soon redefine what’s possible in connected technology—watch this space!” 

With eSIM and iSIM adoption accelerating, the market is primed for rapid expansion. Kigen is thrilled to be at the forefront of this transformation, working alongside industry leaders to simplify security and connectivity for the next generation of connected products. 

Did you feel the same energy at MWC and Embedded World 2025? Let’s continue the conversation on  #FutureofSIM at LinkedIn. #IoT #eSIM #iSIM #Connectivity If you’d like to start your journey with the IoT eSIM future, reach out today for an eIM trail. 

Simplified IoT device connectivity

Managing extensive fleets of IoT devices can be daunting, but Kigen’s eSIM solution leverages automated and bulk profile management to streamline operations.

Read now »

In-Factory Profile Provisioning (IFFP)

In-Factory Profile Provisioning (IFFP) is a relatively new technology that securely embbeds mobile network SIM profiles at the device manufacturing stage.

Download report »

IoT device provisioning for device makers

ABI Research’s report provides a clear roadmap for OEMs looking to capitalize on the advantages of SGP.32 with automation strategies and certification pathways.

Download research »