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Watch On-Demand: Build Faster, Manage Smarter with eSIM and the Single Pane of Glass Advantage
Watch this on-demand webinar to hear from expert speakers at Kigen, Simetric, Nordic Semiconductor, and more, as they discuss how to accelerate eSIM-enabled product development and unlock scalable IoT through smarter connectivity.
The expert panel explores how Nordic’s Thingy:91X prototyping platform seamlessly integrates with Kigen’s eSIM IoT Manager (eIM) to deliver secure, flexible connectivity from lab testing to full-scale global deployment. The discussion also highlights how Kigen and Simetric transform eSIM lifecycle management by combining Simetric’s advanced Connectivity Management Platform (CMP) with Kigen’s eSIM OS. This powerful integration offers complete visibility and control across multi-carrier deployments, helping teams streamline global IoT operations.
Accelerate development and simplify IoT device manufacturing
Discover how to fast-track eSIM-enabled IoT product development using interoperable modules qualified under the Secure with Kigen promise. Learn how to move from prototype to production faster without needing in-house telecom expertise, leveraging trusted module partners and connectivity platforms.
Whether launching your first connected product or scaling a global IoT fleet, this webinar offers actionable insights into solving IoT fleet management challenges with the GSMA SGP.32 eSIM standard.
Key takeaways include how to:
- Leverage interoperable IoT modules qualified under the Secure with Kigen initiative
- Streamline product development using eSIMs built on the GSMA SGP.32 standard
- Accelerate time-to-market by working with trusted module partners and platforms
- Transition from legacy SIMs to eSIM using a unified, single-pane-of-glass approach
- Simplify global eSIM lifecycle and connectivity management to reduce operational complexity
Webinar Q&A: Smarter connected device production with SGP.32 and Kigen Pulse
This blog summarizes the questions and answers from our recent webinar, Watch On-Demand: Build Faster, Manage Smarter with eSIM and the Single Pane of Glass Advantage. During the session, we discussed how Nordic Semiconductor, Kigen and Simetric solutions assist device IoT production and lifecycle management.
Breaking barriers: SGP.32 and the evolution of eSIM for IoT
In the early stages of eSIM development, provisioning standards like SGP.02 (M2M) required deep server-side integration with systems such as SM-SR and SM-DP+, leading to costly and complex deployments. This approach was mainly suitable for industries like automotive but was restrictive for small to mid-sized OEMs aiming to expand globally, primarily served by MVNOs. The introduction of the SGP.32 standard is transforming the landscape.
Designed to make eSIM adoption easier for IoT, SGP.32 enables remote SIM provisioning without extensive server integrations. This lowers the entry barrier and opens opportunities for a wider range of device makers to adopt scalable, embedded connectivity. Now, device makers can choose between a complete stack combining connectivity, CMP, and eSIM management from MVNOs or building their own solution, selecting each of these three layers independently.
Resilient connectivity through smart profile switching
Continuous connectivity is vital for critical applications like logistics, emergency services, or smart infrastructure. eSIM-enabled IoT devices using profile switching can automatically connect to the strongest available network during outages or congestion. This intelligent switching keeps operations running in geographically dispersed or mission-critical environments.
Rescue and recovery logic integrated
Kigen stands out by embedding rescue and recovery logic directly into its eSIM firmware, going beyond the basics to offer resilience where it matters most.
Key features include:
- Rescue: switch to fallback profiles that maintain a network connection even when connectivity with the preferred profile is lost
- Recovery: switch back to another profile in case a preferred connectivity is available again
- Remote Recovery: manage profile switching remotely
These capabilities are essential for reliable, large-scale IoT deployments, especially in remote or industrial environments.
What are the challenges for OEMs and solution providers in adopting eSIM with SGP.32?
Despite significant advancements in eSIM technology and the rollout of GSMA SGP.32, OEMs will likely face challenges in building their complete stack, selecting separately connectivity, CMP, and eSIM and ensuring that the resulting integration supports their use cases. Traditionally, OEM workflows have focused on hardware manufacturing, with physical SIM cards inserted after production. In contrast, eSIM requires connectivity to be embedded, provisioned, and managed remotely, starting from the device design. This transition requires understanding the eUICC profile lifecycle, fallback logic, and how connectivity affects IoT device performance.
Furthermore, while regions like Europe are rapidly advancing their eSIM infrastructure, the readiness of the global ecosystem still varies. Successful adoption requires early and continuous testing and validation with MNOs and MVNOs to evaluate technical compatibility, partner reliability, and solution maturity across different markets.
How does Kigen eIM support OEMs?
As IoT expands into critical sectors such as smart metering, connected vehicles, industrial sensors, and smart cities, reliable, secure, and future-proof connectivity becomes essential. Kigen’s eSIM IoT Manager (eIM) provides a trusted, standards-compliant interface for managing eSIM profiles over public networks using SM-DP+ platforms. Validated across a wide ecosystem of IoT modules, including those supporting LTE-M, NB-IoT, and LTE Cat-1, the “secure with Kigen program” ensures extensive compatibility with eSIM and eIM and significantly reduces integration efforts for OEMs.
This compatibility facilitates faster adoption of SGP.32-compliant eSIMs and prepares deployments for long-term scalability. Kigen helps OEMs support the IoT Profile Assistant (IPA) embedded within the eUICC (IPAe) or hosted on the device (IPAd). When IPAe is integrated into the eSIM, OEMs can avoid complex on-device integration and streamline certification with less engineering effort.
Kigen Pulse: Real-time control and centralized visibility
To support the smooth management of eSIM deployments, Kigen Pulse offers a cloud-based orchestration platform that provides a single-pane-of-glass view for managing connectivity across both MNOs and MVNOs. Fully compliant with SGP.32 and IPAe/D standards, Kigen Pulse simplifies remote SIM provisioning, monitoring, and lifecycle management, ensuring secure and global connectivity.
The platform includes robust OpenAPI 3.0 APIs for easy integration into existing enterprise workflows, enabling automation, real-time control, and centralized visibility. With support for advanced features like over-the-air (OTA) profile switching, fallback management and real-time diagnostics, Kigen Pulse allows OEMs and enterprises to deploy and operate large IoT fleets confidently, reducing operational complexity while improving network resilience and performance.
Does the scaling and management of a fleet change if the form factor is iSIM?
Transitioning from eSIM to iSIM form factors brings notable advantages in scaling, manufacturing, and managing IoT device fleets. Unlike eSIMs, iSIMs are integrated directly into the device’s system-on-chip (SoC), eliminating the need for a separate SIM component. This deep integration simplifies hardware design, reduces the bill of materials and enables smaller, more power-efficient devices, ideal for high-volume, cost-sensitive deployments. iSIM also streamlines manufacturing by embedding connectivity later in the production process. From a management standpoint, enabling secure, scalable and efficient global connectivity with reduced complexity.
Conclusion
The combination of SGP.32 and Kigen Pulse represents a major leap forward in making eSIM for IoT scalable and accessible. OEMs and solution makers can now deliver global devices with resilient, intelligent connectivity, without the burden of fragmented systems or deep telco integration.
